Solder Reflow Guide for Surface Mount Devices
Lattice Semiconductor
This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount
products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which
depends upon the reflow equipment used and the board design. The PCB must be individually characterized to find
the reliable profile. This document covers both the SnPb Eutectic process and the Pb-Free process.
products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which
depends upon the reflow equipment used and the board design. The PCB must be individually characterized to find
the reliable profile. This document covers both the SnPb Eutectic process and the Pb-Free process.
Kateqoriyalar:
Tom:
TN1076
İl:
2004
Nəşr:
2
Nəşriyyat:
Lattice Semiconductor Corp.
Dil:
english
Səhifələr:
5
Seriyalar:
Technical Note
Fayl:
PDF, 42 KB
IPFS:
,
english, 2004
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